AsAP: A Fine-Grained Many-Core Platform for DSP Applications

Abstract:

Many emerging and future applications require significant levels of
complex digital signal processing and operate within limited power
budgets. Moreover, dramatically rising VLSI fabrication and design
costs make programmable and reconfigurable solutions increasingly
attractive. The AsAP project addresses these challenges with a chip
multiprocessor composed of simple processors with small memories,
achieving high energy efficiency and throughput in a small chip area.

Paper

  PDF (2.1 MB),   (c) Copyright, 2008 IEEE
• Table of Contents

Reference

Bevan Baas, Zhiyi Yu, Michael Meeuwsen, Omar Sattari, Ryan Apperson, Eric Work, Jeremy Webb, Michael Lai, Tinoosh Mohsenin, Dean Truong, Jason Cheung "AsAP: A Fine-Grained Many-Core Platform for DSP Applications," IEEE Micro, Volume 27, Number 2, March/April 2007.

BibTeX Entry

@article{baas:micro:2007,
   author    = {Bevan Baas and Zhiyi Yu and Michael Meeuwsen and Omar Sattari
                and Ryan Apperson and Eric Work and Jeremy Webb and Michael Lai
                and Tinoosh Mohsenin and Dean Truong and Jason Cheung},
   title     = {{AsAP}: A Fine-Grained Many-Core Platform for {DSP}
               Applications},
   journal   = {IEEE Micro},
   year      = 2007,
   month     = mar,
   pages     = {34--45},
   volume    = 27,
   number    = 2
   }